UV Improvement Machine of an IC packaging

UV/Ozone dry surface treatment technology has a high effectiveness to clean and modify the surface of solids. It improves a product yield, a quality and a reliability of an IC package.

UV Improvement Machine Model:PM2002N	Light Source and Exposure room

An IC chip mounted on a die-pad and bonded up with a lead frame is irradiated by UV lamps at an exposure room prior to mold by a resin. Figure 1 shows a schematic diagram of the production flow of a 1st level packaging and the UV pre-treatment on a IC chip assembly to improve the surface of substrates and decreases the product failure ratio

Functional & operating principle

A deepUV exposure on a surface has not only a dry cleaning effect but also a high modification effect on the surface of metals and others. Both of effects of a cleaning and improvement decrease the contact angle of a water drop on the surface of solids and increase the adhesive force of the surface.
Some of metals, ceramics and plastics are used as the material to package an IC chip assembly. The plastic package is suitable to be treated by the deep UV exposure. Shown as figure 1, an IC chip assembly is exposed to low pressure mercury lamps prior to mold by resin.

(1) Chip mounting	(3) Molding
(2) UV surface pre-treatment	(4) Final semiconductor device
Fig 1. Brief illustration of a process of a first level package of a VLSI by a resin

Performance

Fig 2. UV irradiation reduces the contact angle of water drop on the SiN film	Fig 3. Relationship of the peel strength and the contact angle on the SiN film

Figure 4 shows the examination of the 100 IC package crack in the atmosphere C shown as follows, Condition ; 30°C*85RH%*24H alt indicates that the deepUV exposure c 48% on the surface reduces the cracking k 50ratio and increases a reliability of the IC elements.

Fig 4. Relationship between packageratio and UV exposure time

It needs only a few minutes to treat awhen the lamps of EUV200S and/or t 0% SUV110S are used as a light source. i 0 The UV treatment will be more o 0 1 2 3 4 5 6 7 8powerful the chip composition will UV exposure time (min)
be more precise. The UV procedure isan essential process for BGA and CSP. Fig 4. Relationship between package

Exposure chamber(Opened). Lamp: EUV200US	Chain type conveyor

SPECIFICATIONS

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