|UV/Ozone IC package surface processing unit|
Roller conveyor type surface processing unit
|Function/Feature||The UV/Ozone surface processing technology has contributed to the production
of LSI products in the enhancement of adhesion power between IC elements
and mold resins, preventing cracks due to boundary separation and extending
life expectancy with improved yield of IC packages.
The energy value of ultraviolet radiation excels in its high uniformity and does not exert damages to the minute elements without any such unnecessary high-energy particles as ion has.
Furthermore, as the process can be carried out in the atmosphere, it also excels in its operability.
The UV/Ozone surface processing technology also contributes as one of the useful production processes to the solution of technical issues in the development of MEMS (MicroElectro-Mechanical System) to integrate a highly value-added device that cannot be made only by LSI.
Pre-treatment for plastic molding of IC, LSI, MEMS, SoC (System on Chip), SiC (System in Chip)
|MODEL PM2002N||MODEL SSP-65|
|Main power||200V, 3P, 3., 50/60Hz||200V;±6%, 10A|
|Conveyor type||Cassette to cassette ,Chain type carrier|
|Magazine number||1pc||4pcs(Loader) ,11pcs(Unloader)|
|Gross lamp wattage||200W||1600W|
|Lamp||Low pressure mercury lamp||Low pressure mercury lamp|
|Cooling type||Water cooling of a lamp house|
|Cooling water flow rate||3 lit. /min|
|Dry air flow rate||50 lit. /min|
|Flow rate||3.4m3 /min|
|Feature||The dry process enables use in atmosphere with cleaning and modifying effect, and causes no damage by high energy to highly integrated minute processing. Another advantage is to generate no wastes harmful to the environment.|
|Data||Introduction of Products|